Introduction of LED Aluminum Substrates

 


As soon as LED aluminum substrates came to the market, the development of the heat dissipation application industry started. Because of the heat dissipation characteristics of LED aluminum substrates, and aluminum substrates have the advantages of high heat dissipation, low thermal resistance, long life, and withstand voltage, with the improvement of production technology and equipment, product prices Accelerate rationalization, and expand the application areas of the LED industry, such as indicator aluminum substrates for home appliances, aluminum substrates for automobile lights, aluminum substrates for street lights, and large outdoor billboards. The successful development of LED aluminum substrates will serve as indoor lighting and outdoor lighting products. In this way, the LED market will be broader.


Definition of Aluminum Substrates


The aluminum substrate is a metal-based copper clad laminate with very good heat dissipation function. Generally, a single panel is mainly composed of a three-layer structure, which is a circuit layer (copper foil), an insulating layer and a metal base layer. For high-end use, there are also designed as double-sided panels, and the structure is circuit layer, insulating layer, aluminum base, insulating layer, and circuit layer. Very few applications are multi-layer boards, which can be formed by bonding ordinary multi-layer boards with insulating layers and aluminum bases.


The Use of LED Aluminum Substrates


Power supply equipment: switching regulator, DC/AC converter, SW regulator, etc.
Audio equipment: input, output amplifier, balanced amplifier, audio amplifier, pre-amplifier, power amplifier, etc.
Communication electronic equipment: high-frequency amplifier `filtering appliance` transmission circuit.
Office automation equipment: motor drives, etc.
Computer: CPU board, floppy disk drive, power supply, etc.
Automobile: electronic regulator, igniter, power controller, etc.
Power module: converter `solid relay` rectifier bridge, etc.


Process and Material Selection


Aluminum substrate PCB consists of circuit layer (copper foil layer), thermally conductive insulating layer and metal base layer. The circuit layer requires a large current-carrying capacity, so thicker copper foil should be used, the thickness is generally 35μm~280μm; the thermally conductive insulating layer is the core technology of the PCB aluminum substrate, which is generally a special polymer filled with special ceramics Structure, low thermal resistance, excellent viscoelasticity, resistance to thermal aging, and able to withstand mechanical and thermal stress.


IMS-H01, IMS-H02 and LED-0601 and other high-performance PCB aluminum substrates thermally conductive insulation layer is using this technology, making it have extremely good thermal conductivity and high-strength electrical insulation performance; the metal base layer is aluminum substrate The supporting member of the steel sheet requires high thermal conductivity, usually aluminum plate, but copper plate can also be used (copper plate can provide better thermal conductivity), suitable for conventional machining such as drilling, punching and cutting. Process requirements include: gold plating, tin spraying, osp anti-oxidation, immersion gold, lead-free ROHS process, etc.

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